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MN101C73A , MN101C73D
Type ROM (x 8-bit) x RAM (x 8-bit) x Package Minimum Instruction Execution Time
MN101C73A (under development) 32 K 1.5 K TQFP064-P-1010C *Lead-free, LQFP064-P-1414 *Lead-free 0.1 s (at 3.0 V to 3.6 V, 10 MHz) 0.235 s (at 1.8 V to 3.6 V, 4.25 MHz) 62.5 s (at 1.8 V to 3.6 V, 32 kHz) * The lower limit for operation guarantee for flash memory built-in type is 2.2 V. * RESET * Watchdog * External 0 * External 1 * External 2 * External 3 * External 4 * External 5 * External 6 (key interrupt dedicated) * Timer 0 * Timer 1 * Timer 2 * Timer 3 * Timer 6 * Time base * Timer 7 (2 systems) * Timer 8 (2 systems) * Serial 0 (2 systems) * Serial 1 (2 systems) * Serial 3 * A/D conversion finish Timer counter 0 : 8-bit x 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier, simple pulse width measurement, added pluse (2-bit) system PWM output) (square-wave/PWM output to large current terminal P50 possible) Clock source ********************* 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ***************** coincidence with compare register 0 Timer counter 1 : 8-bit x 1 (square-wave output, event count, synchronous output event) Clock source ********************* 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input; timer counter 8 output Interrupt source ***************** coincidence with compare register 1 Timer counter 0, 1 can be cascade-connected. Timer counter 2 : 8-bit x 1 (square-wave output, added pluse (2-bit) system PWM output, PWM output, serial transfer clock output, event count, synchronous output event, simple pulse width measurement) (square-wave/PWM output to large current terminal P51 possible) Clock source ********************* 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ***************** coincidence with compare register 2 Timer counter 3 : 8-bit x 1 (square-wave output, event count, serial transfer clock) Clock source ********************* 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency; external clock input Interrupt source ***************** coincidence with compare register 3 Timer counter 2, 3 can be cascade-connected. Timer counter 6 : 8-bit freerun timer Clock source ********************* 1/1 of system clock frequency; 1/1, 1/128, 1/8192 of OSC oscillation clock frequency; 1/1, 1/128, 1/8192 of XI oscillation clock frequency Interrupt source ***************** coincidence with compare register 6 MN101C73D (under planning) 64 K 2K (under planning)
Interrupts
Timer Counter
MAD00047BEM
MN101C73A , MN101C73D
Timer Counter (Continue)
Timer counter 7 : 16-bit x 1 (square-wave output, 16-bit PWM output (cycle / duty continuous variable), event count, synchronous output event, pulse width measurement, input capture, real time output control, high performance IGBT output (Cycle/Duty can be changed constantly)) (square-wave/PWM output to large current terminal P52 possible) Clock source ********************* 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ***************** coincidence with compare register 7 (2 lines), input capture register Timer counter 8: 16 bit x 1 (square-wave/16-bit PWM output [duty continuous variable], event count, pulse width measurement, input capture) (square-wave/PWM output to large current terminal P53 possible) Clock source ********************* 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1, 1/2, 1/4, 1/16 of external clock input frequency Interrupt source ***************** coincidence with compare register 8 (2 lines), input capture register Timer counters 7, 8 can be cascade-connected. (square-wave output, PWM is possible as a 32-bit timer.) Time base timer (one-minute count setting) Clock source ********************* 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency Interrupt source ***************** 1/128, 1/256, 1/512, 1/1024, 1/4096, 1/8192, 1/16384, 1/32768, of clock source frequency Watchdog timer Interrupt source ***************** 1/65536, 1/262144, 1/1048576 of system clock frequency
Serial Interface
Serial 0 : synchronous type/UART (full-duplex) x 1 Clock source ********************* 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency, external clock Serial 1 : synchronous type/UART (full-duplex) x 1 Clock source ********************* 1/2, 1/4 of system clock frequency; pulse output of timer counter 1 or 2; 1/2, 1/4, 1/16, 1/64 of OSC oscillation clock frequency, external clock Serial 3 : synchronous type/single-master I2C x 1 Clock source ********************* 1/2, 1/4 of system clock frequency; pulse output of timer counter 2 or 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation clock frequency, external clock
I/O Pins A/D Inputs LCD
I/O
55
* Common use * Specified pull-up resistor available * Input/output selectable (bit unit)
10-bit x 12-ch. (with S/H) 32 segments x 4 commons (static, 1/2, 1/3, or 1/4 duty) Usable if VLCD VDD LCD power shunt resistance contained Buzzer output, remote control carrier signal output, high-current drive port Correcting address designation : up to 3 addresses possible
Special Ports ROM Correction
See the next page for pin assignment and support tool.
MAD00047BEM
Electrical Characteristics
Supply current
Limit Parameter Symbol IDD1 Operating supply current IDD2 IDD3 Supply current at HALT IDD4 IDD5 Supply current at STOP IDD6 Condition min fosc = 4 MHz, VDD = 3 V fx = 32 kHz, VDD = 3 V fx = 32 kHz, VDD = 3 V, Ta = 25C fx = 32 kHz, VDD = 3 V, Ta = -40C to +85C VDD = 3 V, Ta = 25C VDD = 3 V, Ta = -40C to +85C typ 1 4 2 max 1.8 15 5 10 2 8 mA A A A A A Unit
Pin Assignment
SEG15/P60/SBO0B/TXD0B SEG18/P05/SBO1B/TXD1B 34 SEG14/P61/SBI0B/RXD0B SEG17/P06/SBI1B/RXD1B 35
SEG10/P71/KEY1B
SEG11/P70/KEY0B
SEG13/P62/SBT0B
SEG16/P07/SBT1B
SEG4/P77/KEY7B
SEG5/P76/KEY6B
SEG6/P75/KEY5B
SEG7/P74/KEY4B
SEG8/P73/KEY3B
SEG9/P72/KEY2B
48
47
46
45
44
43
42
41
40
39
38
37
36
SEG3/P64 SEG2/P65 SEG1/P66 SEG0/P67 COM0/P30 COM1/P31 COM2/P32 COM3/P33 SEG24/P8O/SDO0/TM7IOB SEG25/P81/SDO1/TM8IOB SEG26/P82/SDO2/TM0IOB SEG27/P83/SDO3/TM1IOB SEG28/P84/SDO4/TM2IOB SEG29/P85/SDO5/TM3IOB SEG30/P86/SDO6 SEG31/P87/SDO7
33
SEG19/P04/SBT3 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
SEG12/P63
49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
SEG20/SBO3/P03 SEG21/SBI3/IRQ5/P02 SEG22/NBUZZER/IRQ4/P01 SEG23/BUZZERA/IRQ3/P00 IRQ2/SBT1A/P23 IRQ1/SBI1A/RXD1A/P22 IRQ0/SBO1A/TXD1A/P21 Vref+/P20 AN0/KEY7A/TM3IOA/P17 AN1/KEY6A/TM2IOA/P16 AN2/KEY5A/TM1IOA/P15 AN3/KEY4A/SBT0A/TM0IOA/P14 AN4/KEY3A/SBI0A/RXD0A/P13 AN5/KEY2A/SBO0A/TXD0A/P12 AN6/KEY1A/TM8IOA/P11 AN7/KEY0A/TM7IOA/P10
MN101C73A MN101C73D
10
11
12
13
14
15 AN9/BUZZERB/TM7O/LED2/P52
XO
VDD
XI
OSC2
P34/VLC3
P35/VLC2
P36/VLC1
OSC1
VDD (Flash VPP)
NRST/P27
VSS
TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free (under planning)
AN11/RMOUT/TM0O/LED0/P50
AN10/TM2O/LED1/P51
AN8/TM8O/LED3/P53
MMOD
16
1
2
3
4
5
6
7
8
9
MAD00047BEM
MN101C73A , MN101C73D Support Tool
In-circuit Emulator Flash Memory Built-in Type
PX-ICE101C / D + PX-PRB101C73-TQFP064-P-1010C-M (under development) PX-ICE101C / D + PX-PRB101C73-LQFP064-P-1414-M (under development) Type ROM (x 8-bit) RAM (x 8-bit) Minimum instruction execution time MN101CF73A (under development), MN101CF73D (under planning) 32 K, 64K 2.0 K 0.1 s (at 3.0 V to 3.6 V, 10 MHz) 0.235 s (at 2.2 V to 3.6 V, 4.25 MHz) 62.5 s (at 2.2 V to 3.6 V, 32 kHz) Package TQFP064-P-1010C *Lead-free, LQFP064-P-1414 *Lead-free (under planning)
MAD00047BEM
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP

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